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Pre-treatment

Sulfuric-Peroxide Micro-etch

For copper surface cleaning, roughening and thinning with a stable etch rate; tolerates 30 ppm chloride; standalone stabilizer version available.

Key Features

  • For copper surface cleaning, roughening and thinning.
  • Stable etch rate, adjustable via hydrogen peroxide concentration.
  • High-performance stabilizer delivers excellent hydrogen peroxide stability.
  • Suitable for high-chloride environments (< 30 ppm).
  • Standalone stabilizer version available for lower operating cost.

Performance / Application Notes

Contact the Unifree technical team for specific treatment results and application data.