For inner/outer layer dry-film pre-treatment; cleans the copper surface with stronger roughening than conventional micro-etch, improving fine-line yield and tolerating 20 ppm chloride.
Key Features
Suitable for inner/outer layer dry-film pre-treatment.
Cleans the copper surface and provides stronger roughening than conventional micro-etch, improving fine-line yield.
Stable etch rate; at 0.5–1.2 μm micro-etch, Ra = 0.2–0.25 μm, Rz = 2.0–2.5 μm, S/A = 1.8–2.0.
Tolerates up to 20 ppm chloride in the working bath.
Easy wastewater treatment.
Performance / Application Notes
Appearance of the copper surface after conventional micro-etch (photo).Appearance of the medium-roughened copper surface.SEM morphology of the copper surface after conventional micro-etch.At the same 1.0 μm micro-etch, conventional micro-etch gives Ra 0.17 μm / Rz 2.0 μm, while medium roughening yields a rougher surface: Ra ≈ 0.28 μm, Rz ≈ 2.7 μm.
