For copper thinning before fine-line patterning and laser direct drilling; excellent leveling with uniform thickness after thinning.
Key Features
Suitable for copper thinning before fine-line patterning and laser direct drilling.
Excellent leveling performance; uniform thickness after thinning.
Stable, controllable etch rate (3.5–6.0 μm/min).
High solubility; no chemistry residue after rinsing, no impact on downstream processes.
Two dilution ratios available for the same series per customer needs.
Performance / Application Notes
Copper foil surface morphology before treatment and after 4 μm / 8 μm thinning (500×) — uniform treatment morphology.Copper foil thickness distribution before treatment and after 4 μm / 8 μm thinning: thickness range 0.7 μm, 0.8 μm and 1.3 μm respectively — good thinning uniformity.
