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R&D

Sustained R&D investment and true mastery of product mechanisms — delivering forward-looking, cost-effective process chemistry solutions for PCB manufacturers.

R&D GoalsGoals

Through continuous product R&D, we aim to deliver cost-effective process chemistry solutions for PCB manufacturers in line with green manufacturing. R&D projects address current customer needs while anticipating process and recycling-system trends over the next 3–5 years. Through sustained innovation and product optimization, we strive to become a trusted domestic PCB chemistry supplier.

R&D ManagementManagement · IDC Stages

Product R&D follows an “IDC” framework — Idealization, Development and Commercialization. In the I stage, we conduct thorough research and concept design, setting product targets against customer needs; in the D stage, we iteratively optimize formulation and prototype design through lab and prototype testing; in the C stage, full pilot testing ensures performance and reliability meet design targets before commercialization.

I · Idealization

Sufficient research and concept design based on customer requirements to define product specifications.

D · Developing

Lab and prototype testing continuously optimize formula and equipment design.

C · Commercialization

Full pilot testing ensures performance and reliability reach design specs.

Unifree R&D staff performing PCB chemistry analysis
Chemical Analysis · PCB Chemistry Formulation
Unifree R&D staff analyzing PCB cross-sections under microscope
Microscope Analysis · PCB Cross-section Study

Key TopicsKey Topics

We focus on the following chemistries and recycling systems in PCB process development:

Fine Line Formation

Semi-additive, additive processes, and improved etching factor.

New Processes

Dry process replacing wet, printed electronics, smart PCB manufacturing.

Green Technology

Wastewater treatment and on-line reuse of by-products.

Publications & PatentsPapers & Patents

Team members have published 100+ papers in industry journals and academic conferences; the company holds 40+ patents covering electroless copper, plating, pattern formation, surface finishing and wastewater recycling.

100+ Industry Papers

Team members continuously publish in journals and academic conferences.

40+ Patent Technologies

Covering electroless copper, plating, line formation, surface finishing and wastewater reuse.

For detailed publication and patent lists, please contact us.