Meets the roughness required for dry-film and solder-mask pre-treatment. Ammonia-free, holds up to 60 g/L copper, and can eliminate the baking step.
Key Features
Meets the roughness required for dry-film and solder-mask pre-treatment; micro-etch as low as 0.4 μm for dry-film pre-treatment with Ra > 0.30 μm.
Ammonia-free, simplifying wastewater treatment and meeting environmental requirements.
Holds up to 60 g/L copper — significantly reducing chemical consumption, lowering cost and reducing wastewater discharge and treatment expense.
Hyper roughening eliminates baking, reducing process steps with uniform color and no color-defect issues.
Performance / Application Notes
As micro-etch increases, plated copper roughness and surface area increase gradually — the desired micro-etch can be selected per requirement.After 0.5 μm micro-etch with Unifree 3510, dry-film adhesion reaches 10 μm (RD1225, Hitachi).Pads of various sizes built on hyper-roughened substrate, tested by 3M tape after developing: minimum 3×3 mil pads must not lift; 100 similar areas on Unifree's substrate show zero pad lifting.
