Pulse Plating Additive

Key Features

• Suitable for high aspect-ratio pulse plating processes.
• Delivers TP > 95% on 4.0 mm boards with 0.2 mm holes (aspect ratio 20:1).
• Compatible with high-speed plating systems; wide current-density range.

Performance / Application Notes

Delivers stable TP performance for pulse-plating filling on high aspect-ratio boards.