For simultaneous through-hole and blind-via plating on hoist lines and VCP lines at high speed, with high throwing power and dense grain structure.
Key Features
Additive series for simultaneous through-hole and blind-via plating on hoist lines and VCP lines.
CP6106 for flex plating with throwing power (TP) above 150%.
CP6107 has a wide current range and high throwing power (TP up to 80%); on VCP it minimizes anode slime — cleaning once every 5–6 months.
Upgraded CP6107S uses composite ionized polyamine levelers, further improving via filling, widening the current density window and enhancing through/blind-via plating.
CP6109 is a pulse-plating additive for high aspect ratio pulse plating: TP > 95% on 4.0 mm boards with 0.2 mm holes (aspect ratio 20:1).
Performance / Application Notes
Cross-section SEM of the copper deposit (left: ×1,000 overview; right: ×5,000 grain structure) — dense, fine-grained deposit structure.
