For final surface finishing: uniform, dense, glossy, non-tacky OSP film with good heat resistance, compatible with lead-free soldering and three-plus reflow cycles.
Key Features
Suitable for final surface finishing.
Uniform, dense, glossy, non-tacky OSP film with excellent appearance.
Excellent selectivity — film forms on copper while gold stays bright.
Good heat resistance, compatible with lead-free SMT; appearance unchanged after three-plus reflow cycles with excellent solderability.
Water-based solution of non-volatile solvents — environmentally friendly and safe.
Performance / Application Notes
OSP film selectivity test (UV-Vis spectrophotometer): after 60–120 s, OSP thickness is 0.15–0.36 μm on copper and < 0.05 μm on gold.After three reflows the OSP film shows no yellowing or oxidation and passes the Pb-free solderability test.
