Final Finishing

ENEPIG

Electroless nickel–palladium–gold surface finish adapted to lead-free soldering and multiple bonding processes, balancing solderability, reliability, fine-line compatibility and wire bonding.

Key Features

ENEPIG surface finish adapted to lead-free soldering.
Palladium layer effectively blocks nickel migration for reliable solder joints.
Compatible with both gold-wire and aluminum-wire bonding for multifunctional pads.
Suitable for high-density and fine-line surface finish requirements.

Performance / Application Notes

For specific chemical systems and process windows, contact the Unifree technical team.