Final Finishing

ENIG (Electroless Nickel Immersion Gold)

Electroless nickel–immersion gold surface finish providing a flat, solderable Ni/Au surface, ensuring pad solderability and long-term storage reliability.

Key Features

ENIG surface finish ensuring pad flatness and solderability.
Nickel layer provides a good barrier; gold layer provides oxidation protection.
Suitable for BGA, fine-line and high-reliability products.
Good heat resistance and storage reliability.

Performance / Application Notes

For specific chemical systems and process windows, contact the Unifree technical team.