High-dispersion colloidal palladium horizontal electroless copper, ideal for high-layer-count boards, HDI blind vias and flex / rigid-flex copper deposition.
Key Features
High-dispersion electroless copper system suitable for high-layer-count boards.
Colloidal palladium system for more stable backlight performance regardless of material.
Unifree's horizontal electroless copper resolves the hydrolysis of Pd²⁺ and stannous ions — suitable for HDI blind vias without hole-bottom separation risk.
Cyanide-free and nickel-free bath, safe, reliable and environmentally friendly; no copper build-up in the bath.
Performance / Application Notes
Conventional colloidal palladium after one month of activation: rinse tank turbid from stannous chloride hydrolysisUnifree colloidal palladium after one month of activation: rinse tank clear, no Sn²⁺ hydrolysisRinse filter bag with conventional colloidal palladium: heavy tin sludge depositsRinse filter bag with Unifree colloidal palladium: no severe tin sludgeBlind via plating cross-section: no obvious dark line at via bottomThrough-hole backlight cross-sections on materials from different suppliers: backlight rating 9 or above
