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Metallization

Electroless Copper

Three-component room-temperature electroless copper bath producing dense, fine-grained deposits with backlight rating 9+, delivering stable and reliable PTH copper coverage.

Key Features

  • Predip salt maintains the activator bath acidity and concentration for uniform hole-wall wetting.
  • Activator: acidic colloidal palladium activator.
  • Accelerator: mildly alkaline accelerator.
  • Copper bath: three-component room-temperature electroless copper solution.

Performance / Application Notes

Side-by-side comparison on the same equipment: P5350 hole-break rate approx. 3‰ vs. approx. 8‰ for competitor A and approx. 14‰ for competitor B
Side-by-side comparison on the same equipment: P5350 hole-break rate approx. 3‰ vs. approx. 8‰ for competitor A and approx. 14‰ for competitor B
PTH hole-wall backlight photo: continuous, dense copper coverage with backlight rating 9 or above
PTH hole-wall backlight photo: continuous, dense copper coverage with backlight rating 9 or above
SEM image of the electroless copper deposit (×3,000, 5 μm scale bar), showing a dense fine-grained structure
SEM image of the electroless copper deposit (×3,000, 5 μm scale bar), showing a dense fine-grained structure